TC600 laminates best-in-class thermal conductivity and mechanical robustness enable printed circuit board (PCB) size reduction. The increased thermal conductivity provides higher power handling, reduces hot-spots and improves device reliability.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| TC600™ | |
|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 6.15+/-0.15 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 6.15 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0020 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -75 |
| Volume Resistivity Mohm (Typical) | 1.6x109 |
| Surface Resistivity Mohm (Typical) | 3.1x109 |
| Water Absorption D48/50% (Typical) | 0.03(22) |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 1.10 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 9 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 9 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 35 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 8.0(1.4) |
| Density gm/cm3 (Typical) | 3.0 |
| Flammability Rating UL94 | V-0 |
| Lead-Free Process Compatible | Y |
| PIM dBc Typical |
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