Rogers Corporation is a proud leader in thermal solutions that protect electronics and critical systems. The heat generated from electronic devices, systems and circuits require thermal management to maintain prime operating conditions and avoid premature component failure, performance throttling or user discomfort. Rogers Corporation provides solutions to fit every design need by means of heat-storage, heat-conduction and cooling materials. In addition to their sealing, gasketing and cushioning, Rogers Corporation silicones provide thermal insulation capabilities by reducing the transfer of heat between objects.

Heat Conduction

Rogers manufactures several heat conducting thermal management solutions, providing the necessary transfer of heat through solids to maintain optimal operating temperatures.

curamik® ceramic substrates provide high heat spreading, very high isolation voltage and enable chip-on-board production. These substrates use direct bond copper (DBC) technology to join conductors with alumina, aluminum nitride (AlN) or Silicon Nitride (Si3N4) to form high power circuitry.

ML Series™ laminates and prepregs are thermally conductive and spread heat away from components to reduce hot spots. These laminates are used in both single printed circuit boards (PCB) and multilayer PCBs.

TC Series™ laminates provide high power RF signal applications improved thermal management with high thermally conductive ceramic fillers and woven glass reinforcement.

COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is used to bond circuit boards to other materials and provide both thermally and electrically conductive properties.

The Secure® thermal transfer adhesive is a thermally conductive silicone polymer and adhesive material that provides electrical isolation in gaps while providing maximum heat removal.

Active Liquid Cooling

curamik® cooling solutions are hermetically sealed micro or macro channel liquid coolers that combine copper and ceramic DBC substrates with specific channels to provide well controlled thermal resistance, pressure drop and flow rate, ideal for high power applications.

Passive Liquid Cooling

curamik®  CoolEasy is a high precise machined copper cooler that provides a passive liquid cooling thermal management solution often used for laser diode applications.

Thermal Insulation

Whether it be ARLON® or BISCO® silicones, Rogers' thermal insulation materials maintain reliability and functionality by protecting from extreme temperatures in multiple applications.

Temperature Protection

Rogers ProCell™ EV Firewall is a lightweight, ultra-thin and easily processed composite designed for custom solutions across a variety of battery pack designs and may contribute to thermal runaway delay.

Related Products

ARLON® Silicones

Rogers ARLON® Silicone Technologies are the industry leaders in silicone elastomers.

BF-1000 Very Soft Silicone Foam

Rogers BF-1000 Extra Soft Cellular Silicone offers the compressibility, softness and durability needed for various sealing and cushioning applications.


COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards.

curamik® Cooling Solutions

Rogers Corporation offers a suite of advanced liquid cooling solutions powered by the state of the art curamik® bonding process.

EC-2130 Silicone EMI Shield

Rogers BISCO EC-2130 electromagnetic shields are electrically conductive silicones used to reduce EMI and RFI.

EC2265 Electrically Conductive

Rogers BISCO EC2265 Electrically Conductive Silicone dissipates heat from electrostatic discharge.

FPC Silicone Fire Barrier

Rogers BISCO FPC Fire Protective Covering is a patented specialty silicone foam designed to resist flame burn-through at extremely high temperatures.

HT-1200 Series Silicone Rubbers

Rogers BISCO HT-1200 series of general purpose silicone rubbers are firmer in nature, ideal for use in general industrial type applications.

HT-6000 Series Silicones

Rogers BISCO HT-6000 series of performance solid silicones offer enhanced sealing capabilities for medical and industrial appliance applications.

HT-800 Medium Silicone Foam

Rogers BISCO HT-800 Medium Cellular Silicone offers the lightness of foam with the enhanced sealing capabilities of sponge rubber.

HT-820 Firm Silicone Foam

Rogers BISCO HT-820 Firm Cellular Silicone provides enhanced durability and sealing in a wide range of environmental conditions and applications.

HT-840 Extra-Firm Silicone Foam

Rogers BISCO HT-840 Extra Firm Cellular Silicone provides enhanced durability with the excellent sealing properties of sponge rubber.

HT-870 Soft Silicone Foam

Rogers BISCO HT-870 Soft Cellular Silicone is a firmer, denser version of our BF-1000 Silicone and offers the ability to seal and cushion within a wide range of applications.

IF-200 Tear Resistant Foam

Rogers BISCO IF-200 foam is an abrasion-resistant material that can withstand harsh environments with minimal risk of tearing.

MF1® Bun Silicone

Rogers BISCO MF1 Bun silicone offers superior durability and fire resistance in a wide range of cushioning applications.

MS Medical & Life Science Series

Rogers BISCO MS Medical & Life Science Series is a suite of high-performance silicone foams and solids for medical and life science applications.

RF-120 Silicone Heat Shield

Rogers BISCO RF-120 silicone is a specialty reflective foam capable of both insulating against heat and reflecting it away.

TC Series® Laminates

Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.

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