TMM 10 thermoset microwave materials offer the benefits of both PTFE and ceramic based substrates, but is not limited by the same mechanical properties and production techniques.


  • Dielectric Constant (Dk) of 9.20 +/- .230
  • Dissipation factor of .0022 at 10GHz
  • Thermal coefficient of Dk of -38 ppm/°K
  • Coefficient of thermal expansion matched to copper
  • Available in a thickness range of .0015 to .500 inches (+/- .0015”)


  • Mechanical properties resist creep and cold flow
  • Resistant to process chemicals, reducing damage during fabrication
  • Material does not require a sodium napthanate treatment prior to electroless plating
  • Based on a thermoset resin, allowing for reliable wire-bonding



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