TMM® 13i Laminates

TMM 13i microwave material has an isotropic dielectric constant (Dk). Like the other TMM® series materials, TMM 13i combines many of the desirable features of ceramic and PTFE substrates, with the ease of soft substrate processing techniques.

Features

• Dielectric Constant Dk of 12.85 +/- .35
• Dissipation factor of .0019 at 10GHz
• Thermal coefficient of Dk of -70 ppm/°K
• Coefficient of thermal expansion matched to copper
• Available in a thickness range of .0015 to .500 inches +/- .0015”

Benefits

• Mechanical properties resist creep and cold flow
• Resistant to process chemicals, reducing damage during fabrication
• Material does not require a sodium napthanate treatment prior to electroless plating
• Based on a thermoset resin, allowing for reliable wire-bonding

Applications

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