TMM 3 laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials. TMM laminates are based on thermoset resins, making them reliable for wire-bonding without pad lifting or substrate deformation.


  • Dielectric constant (Dk) of 3.27 +/- .032
  • Dissipation factor of .0020 at 10GHz
  • Thermal coefficient of Dk of 37ppm/°K
  • Coefficient of thermal expansion matched to copper
  • Available in a thickness range of .0015 to .500 inches +/- .0015”


  • Mechanical properties resist creep and cold flow
  • Resistant to process chemicals, reducing damage during fabrication
  • Material does not require a sodium napthanate treatment prior to electroless plating



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