AD250C laminates are built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| AD250C™ | AD255C™ | AD300D™ | AD350A™ | |
|---|---|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.50+/-0.04 | 2.55+/-0.04 | 2.97, 3.03 +/-0.05 | 3.50+/-0.05 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 2.52 | 2.60 | 2.94, 3.03 | 3.54 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0013 | 0.0013 | 0.0021 | 0.0033 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -117 | -110 | -73 | -57 |
| Volume Resistivity Mohm (Typical) | 4.8x108 | 7.4x108 | 1.7x108 | 1.5x109 |
| Surface Resistivity Mohm (Typical) | 4.1x107 | 3.6x107 | 5.1x107 | 9.5x107 |
| Water Absorption D48/50% (Typical) | 0.0422 | 0.0322 | 0.04 | 0.1022 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.33 | 0.35 | 0.37 | 0.44 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 47 | 34 | 24 | 18 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 29 | 26 | 23 | 18 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 196 | 196 | 98 | 63 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 14.8 (2.6) | 13.6 (2.4) | 18.3 (3.2) | 14.7 (2.6) |
| Density gm/cm3 (Typical) | 2.28 | 2.28 | 2.23 | 2.43 |
| Flammability Rating UL94 | V-0 | V-0 | V-0 | V-0 |
| Lead-Free Process Compatible | Y | Y | Y | Y |
| PIM dBc Typical | -164 | -164 | -159 | -164 |
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