AD255C laminates combine the superior thermal properties of a fluoropolymer resin system with selected ceramic materials and fiberglass reinforcement to yield a RF laminate material with lower loss, lower thermal expansion properties and lower passive intermodulation (PIM). Stability of PTFE over wide frequency and temperature ranges, with low loss properties, makes AD255C laminates ideal for a variety of microwave and RF applications in telecommunication infrastructure.

Features

  • Very low loss PTFE and ceramic filled composite
  • .0014 loss tangent at 10GHz and base station frequencies
  • Dielectric constant of 2.55 with tight tolerance
  • Low profile copper
  • Low Z-direction CTE (50 ppm/°C)
  • Larger panel sizes available

Benefits

  • Lower insertion loss
  • Low PIM for antenna applications
  • Phase stability due to excellent TCEr
  • Compatible with the processing used for standard PTFE based PCB substrates

Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.

AD250C™ AD255C™ AD300D™ AD350A™
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) 2.50+/-0.04 2.55+/-0.04 2.97, 3.03 +/-0.05 3.50+/-0.05
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) 2.52 2.60 2.94, 3.03 3.54
Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) 0.0013 0.0013 0.0021 0.0033
Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) -117 -110 -73 -57
Volume Resistivity Mohm (Typical) 4.8x108 7.4x108 1.7x108 1.5x109
Surface Resistivity Mohm (Typical) 4.1x107 3.6x107 5.1x107 9.5x107
Water Absorption D48/50% (Typical) 0.0422 0.0322 0.04 0.1022
Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 0.33 0.35 0.37 0.44
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X 47 34 24 18
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y 29 26 23 18
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z 196 196 98 63
Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) 14.8 (2.6) 13.6 (2.4) 18.3 (3.2) 14.7 (2.6)
Density gm/cm3 (Typical) 2.28 2.28 2.23 2.43
Flammability Rating UL94 V-0 V-0 V-0 V-0
Lead-Free Process Compatible Y Y Y Y
PIM dBc Typical -164 -164 -159 -164

Downloads

Description Language File Type File Size
Data Sheet
AD Series Data Sheet - AD250C, AD255C, AD300D and AD350A English
227KB
AD Series™ 天线级层压板 数据资料表 中文
244KB
Fabrication Information
AD Series Laminates Fabrication Guide English
187KB
AD系列高频板加工指南 中文
333KB
Properties - Detailed Characteristics
AD Series™ Laminates Supplemental White Paper English
60KB
Technical Information
PIM and PCB Antennas Guide English
614KB
PIM及PCB天线指南 中文
4MB
(M)SDS/PSIS
AD Series Laminates - PSIS English
164KB
Brochures
High Performance Automotive Circuit Materials - Paving the Way Towards Enhanced Safety, Comfort & Connectivity Solutions English
4MB

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