Our curamik Power substrates are comprised of Al2O3 Direct Bond Copper (DBC), offering the industry’s best price-performance ratio. Al2O3 DBC substrates are offered in many thickness combinations to suit specific applications. This allows control of thermal resistance, which is determined by the heat conductivity and thickness of the ceramics used in the substrate. Our curamik Power substrates can be used in applications with low and medium power output, such as general power electronics, concentrated photovoltaics (CPV), Peltier elements and semiconductor modules for automotive applications.
|curamik Ceramic Substrates Product Information & Data Sheet
|curamik ceramic substrate solutions - High Power Density for Automotive Electrification
|Technical Data Sheet curamik Ceramic Substrates
|curamik® 陶瓷基板 技术数据表
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