DiClad® Series Laminates

DiClad® laminates are Fiberglass Reinforced PTFE-based composites for use in High Frequency Applications as printed circuit board substrates. Controlled Fiberglass and PTFE content and ratio enable DiClad laminates to offer a range of low dielectric constant values. The lowest dielectric constant and loss tangent are achieved with higher relative PTFE content, while a higher ratio of fiberglass reinforcement provides better dimensional stability and registration.

Features

• Low Dielectric Constant – Typical Range: 2.17 to 2.60
• Low Electrical Loss (tan δ from 0.0009 to 0.0018 at X-band)
• Low Moisture Absorption
• Stable Dk Over Frequency

Benefits

• Suitable for Wide-Band Frequency Applications
• Higher Gain in Amplifier and Antenna Designs
• Negligible Performance Drift Caused by High Moisture Environments
• First Article Success Leads to Faster Time to Market

Typical Applications

• Antennas for Commercial Communication Systems
• Airborne and Ground Based RADAR systems
• Lumped Element Filter Designs
• Next Generation Communications Systems

Products

DiClad® 527 Laminates

Fiberglass Reinforced PTFE-based composites for use as printed circuit board substrates.

DiClad® 870/880 Laminates

Woven fiberglass reinforced PTFE composites for use as printed circuit board substrates.

IM Series™ Laminates

• Low PIM (-166 dBc at 0.030”) enables the successful production of high performance antenna designs
• Smooth, low roughness variation copper reduces PCB fabrication scrap due to PIM performance issues
• Tight Dk control resulting in repeatable circuit performance