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Home >> Advanced Connectivity Solutions >> Products >> XtremeSpeed™ RO1200™ Laminates

XtremeSpeed™ RO1200™ Laminates

With channel speeds increasing beyond 50 Gbps, XtremeSpeed RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical requirements of high speed designs. RO1200 circuit materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications.

With a low dielectric constant of 3.05, and a max dissipation factor of 0.0017 @10GHz, XtremeSpeed RO1200 laminates provide outstanding signal integrity, reduced signal skew, and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, XtremeSpeed RO1200 materials are well suited for the most demanding high layer count applications.

Features

  • Low Dielectric Constant (Dk) and Dissipation Factor (Df)
  • Low Profile Rolled Copper Cladding
  • Spread glass Reinforcement for Improved Rigidity and Ease of Handling
  • Low CTE, Td: 500°C (TGA)
  • Halogen Free

Benefits

  • Outstanding signal integrity (SI)
  • Excellent Thermal/Mechanical Performance Characteristics
  • Lead-Free Process Compatible
  • Reduced Signal Skew
  • Ideal for High Layer Count Structures

Typical Applications

  • Core/Edge IP Routers and Switches
  • High Performance Computing (HPC) Servers, Switching and Storage
  • Backplanes
  • Automated Test Equipment (ATE)

Data Sheets

  • RO1200 Data Sheet (English; 110 KB)
  • RO1200系列电路材料数据资料表 (中文; 1 MB)

Fabrication Information

  • Fabrication Guidelines: RO1200 Materials (English; 57 KB)
  • Quick Reference Processing Guidelines: XtremeSpeed RO1200 Materials (English; 68 KB)
  • RO1200超低损耗高速层压板材料加工指南 (中文; 1 MB)
  • RO1200超低损耗高速层压板材料加工指南快速参照表 (中文; 434 KB)
XtremeSpeed™ RO1200™ Laminates

Interview with Mahyar Vahabzadeh at Design Con 2018

Mahyar Vahabzadeh, Market Segment Manager for Rogers Corporation, discusses a paper presented by Dr. Al Horn III at the 2018 Design Con on the effects of copper conductor profile on the propagation of high-speed signals. At higher data rates with thinner circuit layers, the impact from the copper roughness can result in an increase of the propagation constant, as well as the attenuation constant of high-speed transmission lines.

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