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Home >> Advanced Connectivity Solutions >> Products >> RT/duroid® Laminates >> RT/duroid® 5870 Laminates

RT/duroid® 5870 Laminates

RT/duroid® 5870 high frequency laminates are PTFE composites reinforced with glass microfibers. The randomly oriented microfibers result in exceptional dielectric constant uniformity.

The dielectric constant of these high frequency laminates is the lowest of all products, and low dielectric loss make them well suited for high frequency/ broad band applications where dispersion and losses need to be minimized. Because of its extremely low water absorption characteristics, RT/duroid 5870 laminates are ideal for applications in high moisture environments.

RT/duroid 5870 laminates are easily cut, sheared and machined to shape, and resistant to all solvents and reagents normally used in etching printed circuits or plating edges and holes. RT/duroid 5870 and 5880 laminates have the lowest electrical loss of any reinforced PTFE material, low moisture absorption, are isotropic, and have uniform electrical properties over frequency.

Rogers RT/duroid 5870 high frequency laminates are used in:

  • circuitry for commercial airline telephones
  • microstrip and stripline circuits
  • millimeter wave applications
  • military radar systems
  • missile guidance systems
  • point-to-point digital radio antennas

Samples

Samples can be requested through our online request system.

Request Samples

Data Sheets

  • RT/duroid® 5870/ 5880 Data Sheet (English; 699 KB)
  • RTduroid® 5870 5880 数据资料表 (中文; 1 MB)

Electrical Design Data

  • Line Widths for Various Characteristic Impedance of Center Stripline Devices in a Variety of RT/duroid® High Frequency Laminates (English; 59 KB)
  • Design Data for Microstrip Transmission Lines on RT/duroid® Laminates (English; 112 KB)
  • Design Equations for Broadside and Edgewise Stripline (English; 151 KB)
  • Temperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF Current (English; 66 KB)

Fabrication Information

  • Fabrication Guidelines: RT/duroid® 5870/5880 High Frequency Circuit Materials (English; 209 KB)
  • How to Avoid Creep on Board Assemblies (English; 69 KB)
  • After Etch Stress Relief in RT/duroid Microwave Laminates (English; 45 KB)
  • Safety Notes on Using PTFE Composite Material (English; 52 KB)

Product Selection Guides

  • ACS Product Selector Guide and Standard Thicknesses and Tolerances (English; 1 MB)

    Interactive Product Properties Tool Interactive Product Properties Tool

    View Online Version Online Product Selector Guide

Properties - Detailed Characteristics

  • Low Outgassing Characteristics of Rogers Laminates Approved for Spacecraft Applications (English; 57 KB)
  • The Effect of Exposure of RT/duroid® PTFE-Based Composites to Nuclear Radiation (English; 52 KB)
  • The Advantage of Nearly Isotropic Dielectric Constant of RT/duroid® 5870-5880 Glass Microfiber PTFE (English; 57 KB)
  • A Study of Solder Temperature Effect of Copper Foil Adhesion to RT/duroid® 5870 Material (English; 49 KB)
  • Copper Foils for High Frequency Circuit Materials (English; 795 KB)
  • RT/duroid® PTFE-Based Composite Meets Flammability Requirements for Oxygen Environments (English; 45 KB)
  • Good Performance of RT/duroid® Microwave Laminate in a Cryogenic Stripline Application at NASA (English; 41 KB)
RT/duroid® Laminates
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