RT/duroid® 6035HTC Laminates

RT/duroid® 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications.

With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

Rogers advanced filler system enables excellent drillability, reducing drilling costs as compared to standard high thermally conductive laminates which use alumina fillers.

Key Benefits

• High thermal conductivity
  • Improved dielectric heat dissipation, enabling lower operating temperatures for high power applications
• Low loss tangent
  • Excellent high frequency performance
• Thermally stable low profile and reverse treated copper foil
  • Lower insertion loss and excellent thermal stability of traces
• Advanced filler system
  • Improved drillability and extended tool life compared to alumina-containing circuit materials

Typical Applications

• High power RF and microwave amplifiers
• Power amplifiers, couplers, filters, combiners, power dividers

Samples

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Data Sheets

• RT/duroid® 6035HTC High Frequency Laminates (English; 129 KB)
• RTduroid® 6035HTC 数据资料表 (中文; 776 KB)

Fabrication Information

• Fabrication Guidelines: RT/duroid® 6035HTC High Frequency Laminates (English; 144 KB)
• Quick Reference Processing Guidelines: RT/duroid 6035HTC High Frequency Laminates (English; 44 KB)