When reliability, efficiency and performance are critical, design engineers partner with Rogers to develop and deliver the material technologies they require.
Learn More About Our Markets
Leading High-Frequency Circuit Material Solutions
Trusted Sealing, Impact Protection and Vibration Isolation Solutions
High Performance Thermal Management and Energy Efficient Solutions
Molded components for level sensing, document handling, sealing; Integrated circuits (ICs) for electro-luminescent (EL) lighting
Home >> Power Electronics Solutions >> Curamik® Electronics >> curamik® Ceramic Substrates
temperature/ high voltage substrates consist of pure copper bonded to a ceramic
substrate such as Al2O3 (Alumina), AlN (Aluminum Nitride), HPS (ZrO2 doped) or
silicon based Si3N4 (Silicon Nitride).
curamik provides two technologies to
attach the substrate with the copper. DBC (direct bond copper) – a high
temperature melting and diffusion process where the pure copper is bonded onto
the ceramic and AMB (active metal brazing) – a high temperature process where
the pure copper is brazed onto the ceramic substrate.
The high heat conductivity
as well as the high heat capacity and thermal spreading of the thick copper
cladding makes curamik substrates indispensable to power electronics. The
mechanical stress on silicon chips mounted directly on the substrate (Chip on
Board) is very low, since the coefficient of thermal expansion (CTE) of the
ceramic substrate is better matched to the CTE of silicon compared to
substrates using a metal or a plastic basis
curamik substrates are produced in
a master card format of 5“x7“ and 5,5“x7,5“. The individual parts can be left
in the master card format to support more efficient assembly and mounting of
components before being separated into individual pieces. We also offer single
pieces for single piece assembly.